Jan Madsen

Jan Madsen is a full professor in computer based systems at the Department of Informatics and Mathematical Modeling at the Technical University of Denmark, where he is heading the System-on-Chip group. He holds a M.S. in Electrical Engineering (1986) and a Ph.D. in Computer Science (1992), both from the Technical University of Denmark.

Jan Madsen is Program Chair for DATE'07. He was Vice-Program Chair and Tutorial Chair for DATE'06, and Workshop Chair for CODES+ISSS'05. He was Topic Chair of the “Design Tools and Methodologies” track of CASES 2002, Topic Chair “System synthesis and optimization” of DATE 2005, Topic Chair “Hardware/Software Codesign” of DATE 2004 and Topic Co-Chair of DATE 2003, General Chair of CODES 2001 (the Hardware/Software Codesign Symposium), Program Chair of CODES 2000. He is an editorial board member of the journal “IEE Proceedings – Computers and Digital Techniques” and is a member of the steering committee of the IEEE NORCHIP conference. He has served as a technical program committee member on several international (ACM/IEEE) conferences, including DAC 2003 (Design Automation Conference), ISSS+CODES, SoC Symposium, ISSS (International Symposium on System Synthesis), CODES, DATE, EWME, FTRTFT, ED&TC, ACSD and Euromicro DSD (Digital System Design). Jan Madsen is a board member of IEEE Denmark Section and DINA (Danish Informatics Network in Agriculture Science). He is the Danish represetative in IFIP TC10 (International Federation of Information Processing).

His research interests include hardware/software codesign, System-on-Chip design methods, and system level modelling, integration and synthesis for embedded computer systems. He has published more than 70 peer-reviewed papers on design automation and hardware/software codesign and 5 book chapters. His research work has been funded by the Danish Research Council, EU and industrial projects. He has given several invited talks on international events and has lectured on international PhD courses and Summer Schools (in France, Denmark, Sweden and Japan) on hardware/software codesign, multiprocessor System-on-Chip and wireles sensor networks.