Speaker:

Xiaohua Kong, Qualcomm, USA

Title:

High Speed Data Connection in Mobile SoC: from Off Chip to On Chip

Abstract:

The mobile computing and communication industry has been characterized by constant changes and rapid expansions. Increasing sub-system function integration need, aggressive silicon integration technology scaling, efficient mobile wireless and connectivity solutions and advanced low power design techniques, have been critical in enabling mobile computing in a ubiquitous and cost-effective manner. Behind all of them, data communication bandwidth need, at the interface of the mobile SoC, as well as the inter-sub system on SoC, drives necessity of new data communication method and architecture in SoC develop.

In this presentation, we explore the on chip data communication bottleneck and evolution of data communication from off chip to on chip. The challenge and opportunities to develop an efficient communication network infrastructure design to meet the specifications of a low power, high speed and reliable data transmission on chip will be discussed.

Bio:

Dr. Xiaohua Kong received his B.Sc. degree in electrical engineering and microelectronics from Tsinghua University, Beijing, China, in 1997. He received the M.Eng. degree and Ph.D. degree in microelectronics and computer system from McGill University, Montreal, Canada, in 2001 and 2005, respectively. He is currently working in Qualcomm Technology, Inc., San Diego, CA, leading Qualcomm's SerDes system and design team for low power wireline connection solution. His research interests include high quality clock generation and recovery, asynchronous-circuit design and verification, analog assisted digital design, low power-circuit-design methodology, and power-grid analysis.



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