For further information, please contact the General chair: Pierre-Emmanuel Gaillardon
Next Move: Heterogeneous Integration
As the semiconductor industry tries to cope with the slowdown in CMOS scaling and escalated costs, heterogeneous integration has emerged as a viable solution to mitigate the challenge. Depending on the circuit partitioning scheme and strategy, various heterogeneous integration strategies and technologies may be utilized to achieve lower power, faster time to market as well as lower costs to deliver the traditional benefits of CMOS scaling. Next-generation of multicore and multiprocessor SoCs can greatly benefit from heterogeneous integration technologies. In this talk, we will explore the technologies, vision and roadmap of heterogeneous integration as the semiconductor industry tries to digest the slowdown in CMOS scaling.
Farhang Yazdani is the president and CEO of BroadPak Corporation. BroadPak is internationally recognized as the “key provider of innovative total solution for 2.5D/3D products”. Through his 18 years with the industry, he has served in various technical, management, and advisory positions with leading semiconductor companies worldwide. He is widely regarded as an expert in 2.5D and 3D integration technologies. He is the author of the book “Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach”. He is the recipient of 2013 NIPSIA award in recognition of his contribution to the advancement and innovations in packaging technologies. He has numerous publications and IPs in the area of 2.5D/3D Packaging and Assembly, serves on various technical committees and is a frequent reviewer for IEEE Journal of Advanced Packaging. He received his undergraduate and graduate degrees in Chemical Engineering and Mechanical Engineering from the University of Washington, Seattle.