Omar Hammami, ENSTA, France


Systems Engineering Meets Multicore 3D Semiconductor Integration : Feedback from 3D Multicore Chip Designs


3D semiconductor presents several important potential opportunities for multicore. However, many complex challenges need to be solved from EDA tools and design flows down to manufacturing yields before reaching maturity levels of 2D. Unless all the issues are tackled 3D IC design will be possible but not with the expected gains in various metrics therefore representing an economic and industrial threat. Systems Engineering is an interdisciplinary approach and means to enable the realization of successful systems by focusing on defining customer needs and required functionality early in the development cycle, documenting requirements, then proceeding with design synthesis and system validation while considering the complete problem.Systems Engineering integrates all the disciplines and specialty groups into a team effort forming a structured development process that proceeds from concept to production to operation. Systems Engineering considers both the business and the technical needs of all customers. We will provide experience feedback from two 3D IC multicore chip designs on the potential of system engineering for Multicore 3D semiconductor integration and describe the remaining challenges.


Omar Hammami is Professor at ENSTA ParisTech/DGA. His research interests are MPSOC automatic design methodologies (MPSOC synthesis, NOC synthesis), Applied mathematics and optimization for MPSOC, System engineering and embedded systems. He has been involved in numerous research and industrial projects. He is currently involved in 3D IC EDA tools development, 3D Multicore design and Multi-FPGA based Multicore. He is a consultant for several companies and startups involved in multicore SOC EDA and ASIC 3D/2D chip designs.

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