Gabriel Molas

Weebit Nano, Israel

ReRAM Gets Real: From Concept to Market

Biography

Gabriel Molas was born in 1979 in Paris, France. He received the B.S. and M.S. in Physics Engineering, with microelectronics specialization (2001), and the Ph.D. degree in micro- and nano-electronics from the Polytechnics Institute of Grenoble, France (2004), with a thesis on few electron memories. In 2021, he passed Habilitation à Diriger des Recherches, école doctorale EEATS (Univ. Grenoble Alpes), allowing to be PhD director. His research interests concern the processing, engineering, electrical characterization and modelling of innovative non-volatile memory devices.

He joined LETI (Laboratory of Electronics, Technology and Instrumentation of CEA, Grenoble) as a research engineer in 2004. From 2004 to 2011, he was a research scientist, working on the processing of innovative Charge trap memory devices, and responsible from the LETI side of various industrial and institutional projects. In 2011, he moved to Resistive RAM (CBRAM, OXRAM), being in charge of industrial projects. In 2016, he became LETI senior expert on non-volatile memories and in 2021 CEA research director. In 2020 he was also nominated scientific delegate of microelectronic service of LETI. In 2022 he joined Weebit Nano Ltd as Chief Scientific Officer, developing the emerging resistive memory technology.

He is author or co-author of more than 170 publications in international conferences (including 23 IEDM and more than 20 invited talks), 2 shortcourses (IEDM, InMRAM), 1 tutorial, 60 papers in refereed journals, 5 book chapters, 25 patents, 32 as H index. He is/was a reviewer of several international journals (IEEE, Elsevier and Wiley journals). He is/was a member of several technical committees (IEDM “Memory Technology” subcommittee 2010-2011, IEEE ESSDERC technical committee 2015, IRPS “Neuromorphic Computing” committee 2019-2025) and organizing committees (co-organizer of Fall MRS Memory Symposium 2015-2016, 2016-2019 IEEE International Memory Workshop organizing committee, 2018 general chair, 2019-2022 advisory committee member, ESSDERC 2020 Financial chair). In 2019 he became IEEE senior member.

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