Krishna Pradeep

Soitec, France

Secure & Resilient SoCs for Edge AI, IoT, and Automotive — Enabled by Engineered Substrates

Abstract

Edge AI, IoT, and automotive SoCs require not just efficiency and reliability, but also robustness against security threats. Engineered substrates—such as FDSOI—provide key physical-layer benefits: low soft error rates, high-temperature tolerance, dynamic body biasing, and intrinsic isolation. These features enhance protection against fault injection and side-channel attacks while enabling secure, energy-efficient, and functionally safe system design. This talk highlights how substrate-level innovation strengthens the foundation for next-gen intelligent and connected systems.

Biography

Krishna Pradeep is a Product Manager for the Automotive and Industrial SOI Business Unit at Soitec, focusing on driving innovation in power-efficient engineered substrate solutions for automotive systems, and industrial applications. He is responsible for Power-SOI and FD-SOI substrates for these markets. He has a strong technical background in semiconductor device modeling and simulation, with expertise spanning BCD, CMOS and HBT technologies.

Prior to joining Soitec, Krishna Pradeep held R&D roles at STMicroelectronics, Infineon Technologies, and Semtech, contributing to advanced technology development and PDK development. He holds an MSc in Electrical Engineering from EPFL (Switzerland) and a PhD from Université Grenoble Alpes (UGA), where his research focused on modeling the variability in FDSOI devices.

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Pradeep_MPSoC2025.pdf

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