Stewart Bell

Socionext

Beyond Moore’s Law: Driving Competitive Advantage with 3D-Stacked Multi-Die System

Abstract

Advanced packaging technologies play a critical role in sustaining system-level scaling beyond monolithic SoC architectures.

This presentation explores the successful design and tapeout of a cutting-edge TSMC SoIC® 3D-stacked multi-die system. It provides an end-to-end perspective on advanced multi-die design, spanning architectural planning and 3D system exploration through to implementation, verification and signoff.

The talk provides an insight into the key drivers behind the industry shift toward heterogeneous multi-die architectures, as well as the associated challenges—including power integrity, thermal management, die-to-die connectivity, and test. It demonstrates how these challenges can be effectively addressed through a unified 3DIC design flow, advanced EDA solutions and optimized IP integration.

A real-world TSMC SoIC® test chip case study illustrates how two complex dies were successfully developed and taped out in just seven months, highlighting proven methodologies for accelerating development, optimizing design and enabling scalable system integration.

Biography

Stewart as Director for Solution SoC at Socionext Europe, is passionate about leveraging the company’s semiconductor expertise and Solution SoC business model to drive innovation and differentiation in networking, industrial, and automotive applications. With an early career as an engineer designing advanced electronic systems, semiconductor devices and software for marine, industrial, digital broadcast, and automotive applications, Stewart brings a wealth of hands-on experience. Over the past 25 years, he has held leadership roles in the semiconductor industry, spanning engineering management, marketing, and commercial operations.